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        技術服務

        Design services

        來源: 發布時間:2016-4-15 16:21:48 瀏覽次數:0

           

        HuaTian Package Design Team has totel 15 members, all have rich experience that can help customers determine the optimum package for complex integrated circuits, assist customers in designing a package substrate to meet the customer's power, ground and I/O requirements for each pin and conduct thermal and electrical simulations.

            Package Design Team services include:

        ?  Customer-centric design.

        ?  High quality, reliable, and cost effective packaging proposal.

        ?  DFM (Design For Manufacturing) and DFC (Design for Cost).

        ?  Supporting auto- check of design and Drawings.

        Design Capabilities:

           Multi-Chip ModulesMCM

           System-in-Package (SiP)

           Flip Chip Package

           Hybrid Package

           Package-in-Package (PiP)

           Package-on-Package (PoP)

           Embedded Package

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